Light emitting device package

A packaged light emitting device comprising:

• a package comprising a body having a reflective surface, the package further comprising a leadframe;
• the leadframe having a raised portion and a lower portion, the raised portion being exposed through the reflective surface of the body to define at least one bonding area surrounded by the reflective surface;
• a mounting surface for a light emitting device die comprising a continuous surface formed of the at least one bonding area and the reflective surface,
• the lower portion of the leadframe being at least partially encased in the body;
• a conductive bond material covering the at least one bonding area;
• and
• the light emitting device die mounted to the at least one bonding area by the bond material, such that the reflective surface surrounds the light emitting device die.