Lead frame, package, and light-emitting device, and methods for manufacturing the same

A package comprising:

• at least one electrode;
• a supporting member supporting the at least one electrode, the supporting member being made of a resin;
• a lead frame including
• an outer frame, and
• at least one hanger lead connected to the outer frame and separated from the at least one electrode, the at least one hanger lead extending from the outer frame to contact with a side surface of the supporting member, and the at least one hanger lead including at least one chamfered surface arranged on at least a part of an upper side corner of an end of the at least one hanger lead facing the supporting member;
• and
• a depression in which a light-emitting element is to be mounted, the depression being open on an upper side, side walls of the depression being mainly constituted of the supporting member, at least a part of a bottom surface of the depression including the at least one electrode with a lower surface of the at least one electrode being approximately flush with a lower surface of the supporting member.

A package comprising:

• at least one electrode;
• a supporting member supporting the at least one electrode, the supporting member being made of a resin, the supporting member having at least one projection on at least a part of a side surface, the at least one projection having an approximately right triangular shape in a cross-section along a surface normal to a lower surface of the supporting member and parallel to a protruding direction of the at least one projection, the right triangular shape including
• a first side adjacent to a right angle, the first side being on a same plane as the side surface of the supporting member that is normal to the lower surface of the supporting member, and
• a second side adjacent to the right angle, the second side being approximately flush with an upper surface of the at least one electrode;
• and
• a depression in which a light-emitting element is to be mounted, the depression being open on an upper side, side walls of the depression being mainly constituted of the supporting member, at least a part of a bottom surface of the depression including the at least one electrode with a lower surface of the at least one electrode being approximately flush with a lower surface of the supporting member.

A method for manufacturing a lead frame, the method comprising:

• punching a metal plate disposed on a die with a punch in a direction from the metal plate toward a die side to form a punched metal, the punched metal including
• at least one electrode,
• at least one hanger lead separated from the at least one electrode;
• and
• an outer frame connected to the at least one electrode and the at least one hanger lead, and
• stamping at least part of a corner of an end of the at least one hanger lead, the corner being on a side corresponding to the die side, with a vertically split mold to form at least one chamfered surface.

A method for manufacturing a lead frame, the method comprising:

• disposing a metal plate on a die;
• punching the metal plate with a punch in a direction from the metal plate toward a die side to form at least one electrode and at least one hanger lead separated from the at least one electrode;
• and
• performing stamping to chamfer at least a part of a corner of an end of the at least one stamped hanger lead, the corner being on a side corresponding to the die side.

A method for manufacturing a lead frame, the method comprising:

• punching a metal plate from a lower direction toward an upper direction to form a punched metal, the punched metal comprising:
• at least one electrode;
• at least one hanger lead separated from the at least one electrode;
• and
• an outer frame connected to the at least one electrode and the at least one hanger lead;
• and
• stamping at least a part of a corner of an end of the at least one hanger lead, the corner being on an upper side of the punched metal, with a vertically split mold to form at least one chamfered surface.