US 2017/0288102 A1 · THROUGH BACKPLANE LASER IRRADIATION FOR DIE TRANSFER

Abstract

Light emitting devices can be disposed on the front side of a transparent backplane. A laser beam can be irradiated through the transparent backplane and onto a component located on the front side of the transparent backplane. In one embodiment, the component may be a solder material portion that is reflowed to bond the light emitting devices to the transparent backplane. In another embodiment, the component may be a solder material bonded to a defective bonded light emitting device. In this case, the laser irradiation can reflow the solder material to dissociate the defective bonded light emitting device from the transparent backplane. In yet another embodiment, the component may be a device component that is electrically modified by the laser irradiation.

Claims19

Dependent claims

A method of manufacturing an assembly of a backplane and light emitting devices, the method comprising:

providing a substrate with dies of light emitting devices thereupon, wherein a device-side bonding pad is provided on each of the light emitting devices;
bonding at least one of the light emitting devices to the backplane;
and
dissociating each of the at least one bonded light emitting device from the substrate by irradiating a laser beam through the substrate and onto each region of the substrate in contact with the at least one bonded light emitting device.

1 more element

Dependencies are inferred from the claim text.

Through backplane laser irradiation for die transfer

Life of this patent

Through backplane laser irradiation for die transfer

Life of this patent

Abstract

Claims19