Package method and package

A package comprising:

• a substrate;
• a light emitting unit disposed on the substrate, the light emitting unit having a main light emitting surface;
• and
• a molding compound disposed on the substrate and directly encapsulating the light emitting unit, the molding compound comprising a plurality of first phosphor particles and a plurality of second phosphor particles, an emission wavelength of the first phosphor particles being smaller than an emission wavelength of the second phosphor particles, the first phosphor particles in the molding compound having a first concentration per unit volume, the second phosphor particles in the molding compound having a second concentration per unit volume, the first concentration per unit volume being larger than the second concentration per unit volume at a position away from the main light emitting surface, the first concentration per unit volume being smaller than the second concentration per unit volume at a position close to the main light emitting surface.