Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

Abstract

The invention provides an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component (10), comprising the following steps: •A) arranging at least one semiconductor chip (2) on a carrier (1), •B) applying an electrically insulating photoresist (3) to a top side (1a) of the carrier (1) and to the semiconductor chip (2), •C) curing the photoresist (3) with a baking step, •D) patterning the photoresist (3) by exposure, •F) developing the photoresist (3), wherein the photoresist (3) is removed at least from a radiation penetration surface (2b) of the semiconductor chip (2), •G) again curing the photoresist (3) with a baking step, and •H) applying an electrically conductive contact layer (4) to the photoresist (3), wherein the electrically conductive contact layer (4) is in places at a distance (A) from a marginal surface (3a) of the photoresist (3) which faces towards the semiconductor chip (2), wherein the marginal surface (3a) facing towards the semiconductor chip (2) is exposed in places.

Dependencies are inferred from the claim text.