Electronic device, method of manufacturing the same, and camera

A method of manufacturing an electronic device, comprising:

• fixing a first wafer and a second wafer to each other via a surrounding member, such that the first wafer and the second wafer face each other via a space and the surrounding member surrounds the space, the first wafer including a semiconductor substrate and a wiring structure arranged on the semiconductor substrate;
• and
• forming an opening on a side of a second surface of the first wafer on an opposite side of a first surface on a side of the second wafer so as to expose a conductive member of the wiring structure, and then forming an electrode connected to the conductive member exposed via the opening,
• wherein in the fixing, the first wafer includes, on a side of the first surface, a trench that intersects the surrounding member in a planar view of the first surface, and
• in the forming, the electrode is formed under a condition that the space communicates with an external space via the trench.