Semiconductor device, method for manufacturing the same, and electronic device

An imaging device comprising:

• a first substrate including a first connection section;
• a pad electrode within the first semiconductor substrate;
• a pad opening in the first semiconductors substrate exposing a portion of the pad electrode;
• a second substrate including a second connection section, the second substrate being mounted on the first substrate with the first connection section and the second connection section connected to each other by a connecting member, wherein the connecting member is between the first substrate and the second substrate on at least a part of an outer edge of the second substrate;
• at least one bump electrically connecting the first semiconductor substrate to the second semiconductor substrate;
• and
• a filling layer formed between the first substrate and the second substrate, wherein the filling layer includes a protrusion from at least one outer edge of the second substrate, and wherein a region including the connecting member and the filling layer is between a region including the pad opening and a region including the at least one bump.

An electronic device comprising:

• an imaging device;
• an optical system for guiding incident light to an imaging section of the imaging device;
• and
• a signal processing circuit for processing an output signal of the imaging device,
• wherein the imaging device includes:
• a first substrate including a first connection section,
• a pad electrode within the first semiconductor substrate,
• a pad opening in the first semiconductors substrate exposing a portion of the pad electrode,
• a second substrate including a second connection section, the second substrate being mounted on the first substrate with the first connection section and the second connection section connected to each other by a connecting member, wherein the connecting member is between the first substrate and the second substrate on at least a part of an outer edge of the second substrate,
• at least one bump electrically connecting the first semiconductor substrate to the second semiconductor substrate, and
• a filling layer formed between the first substrate and the second substrate, wherein the filling layer includes a protrusion from at least one outer edge of the second substrate, and wherein a region including the connecting member and the filling layer is between a region including the pad opening and a region including the at least one bump.

A method of manufacturing an imaging device, the method comprising:

• forming a first connection section on a first substrate;
• forming a second connection section on a second substrate;
• forming at least one bump on the first semiconductor substrate and/or the second semiconductor substrate;
• mounting the second substrate to the first substrate such that a connecting member is between the first substrate and the second substrate on at least the part of an outer edge of the second substrate;
• and
• forming a filling layer between the first substrate and the second substrate, wherein the filling layer includes a protrusion from at least one outer edge of the second substrate, and wherein a region including the connecting member and the filling layer is between a region including a pad opening and a region including the at least one bump.