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AssigneeSony Semiconductor Solutions Corporation
InventorYOICHI OOTSUKA
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The present disclosure relates to a solid-state imaging device that can achieve a higher image quality by reducing image quality degradation, a method of manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device includes: a semiconductor substrate having photodiodes formed for respective pixels, the photodiodes performing photoelectric conversion; color filters that pass light in the colors corresponding to the respective pixels, the color filters being stacked on the light incident surface side of the semiconductor substrate; and a light shielding film provided between the color filters of the respective pixels, the light shielding film being formed by stacking a first light shielding film and a second light shielding film, the first light shielding film and the second light shielding film being formed with two different materials from each other. The first light shielding film is formed with a metal having a light shielding effect, and the second light shielding film is formed with a resin having photosensitivity. The present technology can be applied to back-illuminated CMOS image sensors, for example.
A solid-state imaging device comprising:
A method of manufacturing a solid-state imaging device, comprising the steps of:
An electronic apparatus comprising
Dependencies are inferred from the claim text.