Back to results
US 2017/0287885 A1Published application
Improved substrate for system in package (sip) devices
AssigneeOctavo Systems LLC
InventorsMasood MURTUZA, Gene Alan FRANTZ
Life of this patent
Estimating the term…
Abstract
Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.
Claims23
A package for multiple circuits in a single package, comprising:
- a substrate containing a preselected number of conductive layers, each layer containing etched portions connected to one or more device wire bond pads for a die pad on the surface of said substrate using at least one via,
- wherein said substrate includes a preselected number of configuration pads on said surface of said substrate arranged in at least one array and connected to preselected portions of said conductive layers with vias;
- a plurality of circuits with external connectors for assembly on said surface of said substrate using said device wire bond pads;
- wherein at least one device wire bond pad is electrically connected to at least one configuration pad;
- and
- a first preselected number of bond wires interconnecting portions of said plurality of circuits using said preselected number of configuration pads,
- wherein said plurality of circuits, said substrate and said bond wires are contained within the package.
4 more elements
A package for predetermined system integration, comprising:
- a substrate containing a preselected number of die pads on the surface of said substrate with each die pad having a preselected number of device wire bond pads,
- wherein said substrate contains one or more conductive layers having etched portions that connect to a preselected number of configuration pads on said substrate surface using at least one via,
- wherein said configuration pads are arranged in at least one array;
- a plurality of circuits for assembly on one of said die pads on said surface of said substrate having external connectors for separate connection with one or more of said device wire bond pads;
- and
- a preselected number of bond wires interconnecting portions of said circuits using said preselected number of configuration pads on said surface of said substrate.
3 more elements
A substrate, comprising:
- a preselected number of conductive layers within said substrate containing predetermined etched portions;
- a plurality of configuration pads on a surface of said substrate arranged in at least one array interconnected with said etched portions;
- a plurality of die pads arranged on said surface of said substrate,
- wherein each die pad has one or more associated device wire bond pads interconnected with said etched portions for interconnecting said device wire bond pads with said configuration pads.
1 more element
A circuit mounting structure, comprising:
- a lead frame having mounting pads for devices;
- lead fingers for interconnection with said devices;
- and
- interconnection rails detachably attached to said frame.
1 more element
A lead frame, comprising:
- external support framing;
- multiple lead fingers removably attached to said framing;
- multiple die pads removably attached to said framing by said lead fingers;
- and
- multiple internal interconnection rails removably attached to said framing.
2 more elements
A method for interconnecting circuits on a substrate, comprising:
- arranging a plurality of circuits on a substrate containing a plurality of configuration pads arranged in an array on the surface of said substrate,
- wherein the plurality of circuits is electrically connected with at least two pads of said plurality of configuration pads;
- and
- making preselected interconnections between at least two of said circuits using wire bonds to connect two or more configuration pads.
1 more element
A method of assembling integrated systems comprising:
- arranging a first plurality of circuits in a first configuration on a first substrate having a plurality of die pads, a plurality of wire bond pads, and a plurality of configuration pads arranged in an array on the surface of said substrate,
- wherein each of said plurality of circuits is electrically connected with at least one of said plurality of wire bond pads, and wherein each of said plurality of wire bond pads is electrically connected with at least one of said plurality of configuration pads;
- connecting two or more of said plurality of configuration pads using bond wires to interconnect said first plurality of circuits to form a first integrated system;
- arranging a second plurality of circuits in a second configuration on a second substrate,
- wherein the second substrate has the same layout and structure as the first substrate;
- and
- connecting two or more of the plurality of configuration pads of the second substrate using bond wires to interconnect said second plurality of circuits to form a second integrated system,
- wherein the first integrated system differs from the second integrated system.
5 more elements
Dependencies are inferred from the claim text.