Electronic Device Package Having a Dielectric Layer and an Encapsulant
AssigneeInfineon Technologies AG
InventorsEdward Fuergut, Holger Doepke, Olaf Hohlfeld, Michael Juerss
Life of this patent
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Abstract
A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip having a contact pad on a main face thereof remote from the carrier, applying a contact element onto the contact pad, applying a dielectric layer on the carrier, the semiconductor chip, and the contact element, and applying an encapsulant onto the dielectric layer.
Claims23
A method for fabricating an electronic device package, the method comprising:
- providing a carrier;
- disposing a semiconductor chip onto the carrier, the semiconductor chip comprising a contact pad on a main face of the semiconductor chip;
- applying a contact element onto the contact pad;
- applying a dielectric layer on the carrier, the semiconductor chip, and the contact element;
- and
- applying an encapsulant onto the dielectric layer.
The method of 1, wherein applying the dielectric layer comprises:
- depositing a first dielectric layer and treating the deposited first dielectric layer with a first set of conditions;
- and
- depositing a second dielectric layer and treating the deposited second dielectric layer with a second set of conditions different from the first set of conditions.
An electronic device package, comprising:
- a semiconductor chip comprising a contact pad on a main face of the semiconductor chip;
- a contact element disposed on the contact pad;
- a dielectric layer disposed on the semiconductor chip and the contact element;
- and
- an encapsulant disposed onto the dielectric layer.
An electronic voltage converter module, comprising:
- a carrier;
- a plurality of semiconductor transistor chips disposed on the carrier, each one of the semiconductor transistor chips comprising at least one contact pad on a main face thereof remote from the carrier;
- a contact element disposed on each one of the contact pads;
- a dielectric layer disposed on the carrier, the semiconductor transistor chips, and the contact elements;
- and
- an encapsulant disposed on the dielectric layer;
- wherein the semiconductor transistor chips are electrically interconnected to form one or more of a motor drive circuit, a half-bridge circuit, an AC/AC converter circuit, a DC/AC converter circuit, a DC/DC converter circuit, and a buck converter circuit.
Dependencies are inferred from the claim text.