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US 2017/0287877 A1Published application
Semiconductor package assembly
AssigneeMediatek Inc.
InventorsTzu-Hung LIN, Ching-Wen HSIAO, I-Hsuan PENG
Life of this patent
Estimating the term…
Abstract
In one implementation, a semiconductor package assembly includes a semiconductor die, a first molding compound covering a back surface of the semiconductor die, a redistribution layer (RDL) structure disposed on a front surface of the semiconductor die, wherein the semiconductor die is coupled to the RDL structure, and a passive device, embedded in the redistribution layer (RDL) structure and coupled to the semiconductor die.
Claims23
A semiconductor package assembly, comprising:
- a semiconductor die;
- a first molding compound covering a back surface of the semiconductor die;
- a redistribution layer (RDL) structure disposed on a front surface of the semiconductor die, wherein the semiconductor die is coupled to the RDL structure;
- a passive device, embedded in the redistribution layer (RDL) structure and coupled to the semiconductor die.
1 more element
A semiconductor package assembly, comprising:
- a semiconductor die;
- a first molding compound disposed on a first surface of the semiconductor die;
- a redistribution layer (RDL) structure disposed on a second surface opposite the first surface of the semiconductor die;
- a passive device disposed on a second molding compound and coupled to the semiconductor die, wherein an surface of the passive device is aligned to a first surface of the redistribution layer (RDL) structure, which is away from the semiconductor die.
1 more element
A semiconductor package assembly, comprising:
- a semiconductor die;
- a first molding compound in contact with a first surface of the semiconductor die;
- a redistribution layer (RDL) structure covering a first portion of a second surface opposite the first surface of the semiconductor die;
- a first underfill covering a second portion of the second surface of the semiconductor die and embedded in the RDL structure;
- and
- a passive device covering the second portion of the second surface of the semiconductor die, wherein the first underfill is disposed between the semiconductor die and the passive device.
3 more elements
Dependencies are inferred from the claim text.