Electronic assembly components with corner adhesive for warpage reduction during thermal processing

An electronic assembly comprising:

• an integrated circuit including:
• an integrated circuit die;
• a first substrate having a first surface and a second surface and four corners;
• and
• a first plurality of solder bump structures electrically coupling the die to the first surface of the first substrate;
• a second substrate;
• a second plurality of solder bump structures electrically coupling the second surface of the first substrate to the second substrate;
• and
• an adhesive disposed only at or near the four corners of the second surface of the first substrate, wherein the adhesive is disposed between the first substrate and the second substrate and is configured to couple the first substrate and the second substrate to prevent warpage of the electronic assembly during high temperature processing of the electronic assembly.

A method of preventing warpage of components of an electronic assembly during fabrication of the electronic assembly, comprising:

• providing a first component having a first surface and a second surface;
• applying a first plurality of solder bump structures to the first surface of the first substrate;
• applying an adhesive only at or near four corners of the first surface of the first component in order to couple the first component and a second component during high temperature processing and to limit bridging of the solder bump structures and warpage of the first and the second components;
• providing the second component;
• placing the second component in contact with the plurality of solder bump structures and the adhesive on the first surface of the first substrate;
• and
• thermally processing the first component and the second component after the second component is in contact with the plurality of solder bump structures and after the adhesive on the first surface of the first substrate is cured and has coupled the first component and the second component together.