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US 2017/0287867 A1Published application
Anisotropic conductive film including a reflective layer
AssigneeTrillion Science, Inc.
InventorsRong-Chang Liang, Chia-Teng Hsiao, Shun-Pin Yang, Jing-Den Chen, Pi-Yang Chuang
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Abstract
An anisotropic conductive film (ACF) is disclosed. In one approach, the ACF includes a non-reflective adhesive layer including a top surface, a plurality of conductive particles included with the non-reflective adhesive layer, and a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer.
Claims40
An anisotropic conductive film (ACF), comprising:
- a non-reflective adhesive layer including a top surface;
- conductive particles at least partially embedded into a surface of the non-reflective adhesive layer;
- and
- a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer, wherein the reflective adhesive layer comprises at least 30% reflective particles by percentage weight of the reflective adhesive layer.
1 more element
A light-emitting device, comprising:
- a light-emitting housing comprising a plurality of light-emitting elements or chips, the chips comprising a chip bump for electrical connection to the electrodes of the electrode substrate;
- an electrode substrate;
- and
- an anisotropic conductive film (ACF) electrically connecting the light-emitting elements or the chip bump to the electrodes of the electrode substrate, comprising:
- a non-reflective adhesive layer including a top surface;
- conductive particles at least partially embedded into a surface of the non-reflective adhesive layer;
- and
- a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer, wherein the reflective adhesive layer includes at least 30% reflective particles by percentage weight.
5 more elements
A light-reflecting or transflecting device, comprising:
- a housing;
- an electrode substrate;
- an anisotropic conductive film (ACF) electrically connecting the housing and the electrode substrate, comprising:
- a non-reflective adhesive layer including a top surface;
- a plurality of conductive particles included with the non-reflective adhesive layer;
- and
- a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer, wherein the reflective adhesive layer includes at least 30% reflective particles by percentage weight;
- and
- a plurality of chip bumps or thin film transistors in contact with at least a portion of the conductive particles.
6 more elements
Dependencies are inferred from the claim text.