Interlayer filler composition for semiconductor device and method for producing semiconductor device

Abstract

To provide an interlayer filler composition capable of forming a cured adhesive layer sufficiently cured and excellent in adhesion without letting voids be formed in the cured adhesive layer while minimizing leak out of a filler. An interlayer filler composition for a semiconductor device, comprises an epoxy resin (A), a curing agent (B), a filler (C) and a flux (D), has a minimum value of its viscosity at from 100 to 150° C. and satisfies the following formulae (1) and (2) simultaneously: 10<η50/η120<500   (1) 1,000<η150/η120   (2) (wherein η50, η120 and η150 represent the viscosities at 50° C., 120° C. and 150° C., respectively, of the interlayer filler composition).

Dependencies are inferred from the claim text.