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AssigneesNippon Micrometal Corporation, Nippon Steel & Sumikin Materials Co., Ltd.
InventorsTakashi YAMADA, Daizo ODA, Teruo HAIBARA, Shinichi TERASHIMA
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A material for Cu pillars is formed as cylindrical preforms in advance and connecting these cylindrical preforms to electrodes on a semiconductor chip to form Cu pillars. Due to this, it becomes possible to make the height/diameter ratio of the Cu pillars 2.0 or more. Since electroplating is not used, the time required for production of the Cu pillars is short and the productivity can be improved. Further, the height of the Cu pillars can be raised to 200 μm or more, so these are also preferable for moldunderfill. The components can be freely adjusted, so it is possible to easily design the alloy components to obtain highly reliable Cu pillars.
A cylindrical preform having Cu as a main component, satisfying one or more of (a) to (d) among (a) having one or more of Pd, Pt, Au, and Ni in a total of 5.0 mass % or less, (b) having Ti in 15 mass ppm or less, (c) having P in 150 mass ppm or less, and (d) having a total of a content of S and a content of Cl contained as impurities of 1 mass ppm or less, having a cylindrical shape with a diameter of 50 to 100 μm, having a height/diameter ratio of that cylinder of 2.0 or more, and used as a Cu pillar for semiconductor connection.
A cylindrical preform having Cu as a main component, satisfying one or more of (a) to (d) among (a) having one or more of Pd, Pt, Au, and Ni in a total of 5.0 mass % or less, (b) having Ti in 15 mass ppm or less, (c) having P in 150 mass ppm or less, and (d) having a total of a content of S and a content of Cl contained as impurities of 1 mass ppm or less, having a cylindrical shape with a diameter of 100 to 400 μm, and used as a Cu pillar for semiconductor connection.
Dependencies are inferred from the claim text.