Method of manufacturing semiconductor device
AssigneeRenesas Electronics Corporation
InventorHideki HARANO
Life of this patent
Estimating the term…
Abstract
To improve reliability of a semiconductor device, in a method of manufacturing the semiconductor device, a semiconductor substrate having an insulating film in which an opening that exposes each of a plurality of electrode pads is formed is provided, and a flux member including conductive particles is arranged over each of the electrode pads. Thereafter, a solder ball is arranged over each of the electrode pads via the flux member, and is then heated via the flux member so that the solder ball is bonded to each of the electrode pads. The width of the opening of the insulating film is smaller than the width (diameter) of the solder ball.
Claims11
A method of manufacturing a semiconductor device, comprising the steps of:
- (a) providing a semiconductor substrate including an electrode pad and an insulating film in which an opening that exposes the electrode pad is formed;
- (b) after the step (a), arranging a flux member having a conductive member over a surface of the electrode pad exposed through the opening;
- (c) after the step (b), arranging a solder ball over the electrode pad via the flux member;
- and
- (d) after the step (c), melting the solder ball by transferring heat from the electrode pad to the solder ball via the conductive member included in the flux member, and bonding the solder ball to the electrode pad,
- wherein, in a cross-section view, a width of the opening of the insulating film is smaller than a width of the solder ball.
Dependencies are inferred from the claim text.