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US 2017/0287856 A1Published application
Electronic component package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYun Tae LEE, Moon Il KIM
Life of this patent
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Abstract
An electronic component package includes: a frame, including a through-hole and a through-wiring; an electronic component disposed in the through-hole of the frame; a metal plate disposed on a first side of the electronic component and the frame; and a redistribution layer disposed on a second side of the electronic component opposing the first side and electrically connected to the electronic component.
Claims15
An electronic component package comprising:
- a frame including a through-hole and a through-wiring;
- an electronic component disposed in the through-hole of the frame;
- a metal plate disposed on a first side of the electronic component and the frame;
- and
- a redistribution layer disposed on a second side of the electronic component opposing the first side and electrically connected to the electronic component.
2 more elements
Dependencies are inferred from the claim text.