Stacked Die Ground Shield

A circuit comprising:

• a lead frame;
• a first die mounted on the lead frame in flip-chip fashion, with the front of the first die connected to the lead frame;
• wherein the first die comprises an oxide layer deposited on the back of the first die and a back metal layer deposited on the oxide layer;
• a second die mounted on the back metal layer of the first die;
• the back metal layer wire bonded to a finger of the lead frame;
• and
• a voltage source providing a shielding voltage fed to the back metal layer through the finger;
• wherein the oxide layer and the back metal layer both cover a full extent of the backside of the first die and do not extend beyond edges of the first die.

A method for manufacturing a semiconductor device, comprising:

• manufacturing a first semiconductor die comprising at least one semiconductor device;
• depositing an oxide layer on a back side of the die;
• and
• depositing a back metal layer on top of the oxide layer;
• wherein the oxide layer and the back metal layer both cover a full extent of the backside of the first die and do not extend beyond edges of the first die.

A method of operating an integrated circuit package including a lead frame, a first die mounted on the lead frame in flip-chip fashion, with the front of the first die connected to the lead frame, wherein the first die comprises an oxide layer deposited on the back of the first die and a back metal layer deposited on the oxide layer, a second die mounted on the back metal layer of the first die, the back metal layer wire bonded to a finger of the lead frame, wherein the oxide layer and the back metal layer both cover a full extent of the backside of the first die and do not extend beyond edges of the first die and a voltage source providing a shielding voltage fed to the back metal layer through the finger, the method comprising:

• generating a shielding voltage;
• feeding the shielding voltage to said finger of the lead frame;
• and
• operating a circuit and devices within the first and second dies.