Semiconductor device and method of manufacturing the same

A semiconductor device, comprising:

• a substrate;
• a first magnetic substrate located over a first surface of the substrate, the first magnetic substrate comprising a base, a first side wall portion and a second side wall portion disposed at opposed ends of the base, the first and the second side wall portions extending from the base;
• a semiconductor chip located over the base of the first magnetic substrate;
• a second magnetic substrate in direct contact with the first side wall portion and the second side wall portion;
• a wire connecting between the semiconductor chip and the substrate;
• and
• a sealing material sealing the semiconductor chip and the wire.

A method of manufacturing a plurality of semiconductor devices, comprising:

• providing a substrate;
• providing, on the substrate, a plurality of first magnetic substrates, each magnetic substrate including a base, a first side wall portion and a second side wall portion disposed at opposed ends of the base, the sidewall portions extending from the base;
• providing a semiconductor chip over the base of the magnetic substrates in a location thereof between the first side wall portion and the second side wall portion;
• and
• providing a plate-like magnetic substrate having a second surface, the second surface having a width dimension larger than the sum of the widths of the first magnetic substrates, the second surface having a resin thereon;
• positioning the plate-like magnetic substrate having the second surface with the resin thereon such that the second surface faces the bases of each of the first magnetic substrates;
• and
• moving the plate like magnetic substrate in the direction of the first magnetic substrates to contact the second surface of the plate like magnetic substrate with the first side wall portion and the second side wall portion of each of the first magnetic substrates.