Electronic circuit package using composite magnetic sealing material
AssigneeTDK Corporation
InventorKENICHI KAWABATA
Life of this patent
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Abstract
Disclosed herein is an electronic circuit package includes a substrate, an electronic component mounted on a surface of the substrate, and a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component. The magnetic mold resin includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° C. or less.
Claims20
An electronic circuit package comprising:
- a substrate;
- an electronic component mounted on a surface of the substrate;
- and
- a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component,
- wherein the magnetic mold resin includes:
- a resin material;
- and
- a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less, and
- wherein the filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° C. or less.
An electronic circuit package comprising:
- a substrate;
- an electronic component mounted on a surface of the substrate;
- and
- a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component,
- wherein the magnetic mold resin includes:
- a resin material;
- a magnetic filler formed of an Fe—Ni based material blended in the resin material, the magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, and
- a non-magnetic filler blended in the resin material,
- wherein a ratio of an amount of the non-magnetic filler relative to a sum of an amounts of the magnetic filler and the non-magnetic filler is 1 vol. % or more and 40 vol. % or less, and
- wherein a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° C. or less.
(canceled)
An electronic circuit package comprising:
- a substrate;
- an electronic component mounted on a surface of the substrate;
- and
- a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component,
- wherein the magnetic mold resin includes:
- a resin material;
- a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni blended in the resin material;
- and
- a non-magnetic filler blended in the resin material,
- wherein a blended ratio of the magnetic filler in the resin material is 30 vol. % or more to 85 vol. % or less, and
- wherein a blended ratio of the magnetic filler and the non-magnetic filler in the resin material is 50 vol. % or more and 85 vol. % or less.
Dependencies are inferred from the claim text.