Integrated circuit package having integrated emi shield

A method for providing EMI shielding for in integrated circuit package, the method comprising;

• creating a first conductive fence about a cavity of the substrate;
• electrically coupling and mounting an integrated circuit to terminations of the substrate within the cavity of the substrate;
• covering the cavity with a conductive sheet;
• and
• coupling the conductive sheet with the conductive fence;
• wherein creating the conductive fence includes:
• fabricating an opening in a first layer of the substrate, the opening configured to form a portion of a sidewall of the cavity;
• fabricating a plurality of traces of the first layer, the plurality of traces positioned about the opening;
• fabricating a plurality of conductive vias, each via coupled to a corresponding trace of the plurality of traces;
• and
• fabricating a conductive mesh within a second layer of the substrate, the conductive mesh configured to underlie the cavity and to allow electrically isolated vertical connections between the integrated circuit and external connections exposed on a major surface of the substrate underlying the cavity.