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US 2017/0287845 A1Published application
Alignment Mark Design for Packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLi-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu
Life of this patent
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Abstract
A package includes a device die, a molding material molding the device die therein, a through-via penetrating through the molding material, and an alignment mark penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via.
Claims20
A package comprising:
- a molding material;
- a device die disposed in the molding material and comprising a metal pillar at a surface of the device die;
- a first through-via disposed in the molding material and adjacent to the device die;
- a second though-via disposed in the molding material and adjacent to the first through-via, wherein the second through-via is an alignment mark, and is electrically floating;
- a first redistribution line on a first side of the molding material;
- and
- a second redistribution line on a second side of the molding material, with the second side being opposite to the first side, wherein the first redistribution line is electrically coupled to the second redistribution line through the first through-via.
4 more elements
A package comprising:
- a device die;
- an encapsulating material molding the device die therein;
- a through-via penetrating through the encapsulating material;
- an alignment mark penetrating through the encapsulating material;
- and
- a redistribution line on a side of the encapsulating material, wherein the redistribution line is electrically coupled to the through-via.
3 more elements
A package comprising:
- a device die comprising a metal pillar at a surface of the device die;
- a plurality of through-vias surrounding the device die;
- an alignment mark, wherein the alignment mark is electrically floating, and the alignment mark comprises a first surface and a second surface opposite to each other;
- an encapsulating material molding the device die, the alignment mark, and the plurality of through-vias therein;
- a first plurality of redistribution lines on a first side of the encapsulating material;
- and
- a second plurality of redistribution lines on a second side of the encapsulating material, with the second side being opposite to the first side, wherein the first plurality of redistribution lines is electrically coupled to the second plurality of redistribution lines through the plurality of through-vias.
4 more elements
Dependencies are inferred from the claim text.