Semiconductor device having contact plugs with different interfacial layers
AssigneeUnited Microelectronics Corp.
InventorsJia-Rong Wu, Ying-Cheng Liu, Ching-Wen Hung, Yi-Hui Lee, Chih-Sen Huang
Life of this patent
Estimating the term…
Loading patent…
AssigneeUnited Microelectronics Corp.
InventorsJia-Rong Wu, Ying-Cheng Liu, Ching-Wen Hung, Yi-Hui Lee, Chih-Sen Huang
Estimating the term…
According to a preferred embodiment of the present invention, a semiconductor device is disclosed. The semiconductor device includes: a substrate having a first region and a second region; a first contact plug on the first region, and a second contact plug on the second region. Preferably, the first contact plug includes a first interfacial layer having a first conductive type and a first work function metal layer having the first conductive type on the first interfacial layer, and the second contact plug includes a second interfacial layer having a second conductive type and a second work function metal layer having the second conductive type on the second interfacial layer.
A semiconductor device, comprising:
(canceled)
(canceled)
Dependencies are inferred from the claim text.