Electrical interconnect bridge
AssigneeIntel Corporation
InventorsSrinivas V. Pietambaram, Rahul N. Manepalli
Life of this patent
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Abstract
Electrical interconnect bridge technology is disclosed. An electrical interconnect bridge can include a bridge substrate formed of a mold compound material. The electrical interconnect bridge can also include a plurality of routing layers within the bridge substrate, each routing layer having a plurality of fine line and space (FLS) traces. In addition, the electrical interconnect bridge can include a via extending through the substrate and electrically coupling at least one of the FLS traces in one of the routing layers to at least one of the FLS traces in another of the routing layers.
Claims28
An electrical interconnect bridge to be embedded in a package substrate, comprising:
- a molded bridge substrate comprising a mold compound material;
- a plurality of routing layers within the bridge substrate, each routing layer having a plurality of fine line and spaced (FLS) traces;
- and
- a via extending through the bridge substrate and electrically coupling at least one of the FLS traces in one of the routing layers to at least one of the FLS traces in another of the routing layers to route electrical signals between a first electronic component and a second electronic component supported by the package substrate.
An electronic device package substrate assembly, comprising:
- a package substrate;
- and
- an electrical interconnect bridge embedded in the package substrate configured to route electrical signals between a first electronic component and a second electronic component coupled to the package substrate, the electrical interconnect bridge having
- a molded bridge substrate comprising a mold compound material,
- a first routing layer within the bridge substrate having a first plurality of fine line and spaced (FLS) traces,
- a second routing layer disposed proximate the first routing layer within the bridge substrate having a second plurality of FLS traces, and
- a via extending through the bridge substrate and electrically coupling at least one of the first plurality of FLS traces to at least one of the second plurality of FLS traces.
A method for making a via for electrically coupling conductive elements, comprising:
- forming a spacer on a conductive element;
- molding a mold material at least partially about lateral sides of the spacer;
- removing the spacer to form an opening in the mold material in communication with the conductive element;
- and
- disposing a conductive material in the opening to form a via.
Dependencies are inferred from the claim text.