Semiconductor package devices integrated with inductor
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWEI-TING CHEN, IN-TSANG LIN, VINCENT CHEN, CHUEI-TANG WANG, CHEN-HUA YU
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Abstract
The present disclosure provides an inductor structure. The inductor structure, comprising a first surface, a second surface intersecting with the first surface, a first conductive pattern and a second conductive pattern. The first conductive pattern is formed on the first surface. The second conductive pattern is formed on the second surface. The first conductive pattern is connected with the second conductive pattern.
Claims25
An inductor structure, comprising:
- a first surface and a second surface intersecting with the first surface;
- a first conductive pattern formed on the first surface;
- a second conductive pattern formed on the second surface,
- wherein the first conductive pattern is connected with the second conductive pattern.
An inductor structure, comprising:
- a first conductive pattern having a plurality of conductive metals;
- a first dielectric layer encapsulating the first conductive pattern;
- and
- a second conductive pattern on the first dielectric layer;
- wherein the second conductive pattern is electrically connected with a first conductive metal and a second conductive metal of the first conductive pattern.
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A semiconductor device, inductor structure, comprising:
- a carrier;
- an integrated circuit on the carrier;
- an inductor structure on the carrier and adjacent to the integrated circuit, the inductor structure comprising:
- a first surface;
- a second surface parallel to the first surface;
- a first conductive pattern on the first surface;
- a second conductive pattern on the second surface,
- wherein the first conductive pattern is connected with the second conductive pattern by a through via structure on a third surface, the third surface being perpendicular to the first surface and the second surface.
Dependencies are inferred from the claim text.