Semiconductor module

A semiconductor module comprising:

• a substrate on which a first wiring pattern, a second wiring pattern, and a third wiring pattern are formed on a principal surface;
• a vertical first transistor chip mounted on the substrate;
• and
• a vertical second transistor chip mounted on the substrate, wherein
• the first transistor chip has
• a first main electrode pad and a second main electrode pad, and
• a first control electrode pad to which a control voltage is supplied for controlling conduction between the first main electrode pad and the second main electrode pad,
• the first main electrode pad and the first control electrode pad are formed on a front surface of the first transistor chip,
• the second main electrode pad is formed on a back surface of the first transistor chip,
• the second transistor chip has
• a third main electrode pad and a fourth main electrode pad, and
• a second control electrode pad to which a control voltage is supplied for controlling conduction between the third main electrode pad and the fourth main electrode pad,
• the third main electrode pad and the second control electrode pad are formed on a front surface of the second transistor chip,
• the fourth main electrode pad is formed on a back surface of the second transistor chip,
• the first transistor chip is mounted on the first wiring pattern such that the back surface of the first transistor chip faces the principal surface of the substrate, thereby connecting the second main electrode pad to the first wiring pattern,
• the first control electrode pad is electrically connected to the second wiring pattern,
• the second transistor chip is mounted on the first wiring pattern such that the front surface of the second transistor chip faces the principal surface of the substrate, thereby connecting the third main electrode pad to the first wiring pattern, and
• the second control electrode pad of the second transistor chip is electrically connected to the third wiring pattern.