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US 2017/0287827 A1Published application
Semiconductor package substrate having an interfacial layer
AssigneeIntel Corporation
InventorsWhitney Michael Bryks, Bainye Francoise Angoua, Dilan Anuradha Seneviratne
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Abstract
Semiconductor package substrates and methods of forming semiconductor package substrates are described. In an example, a semiconductor package substrate includes an interfacial layer between a metal layer and a dielectric layer. For example, the interfacial layer may be attached to the metal layer and the dielectric layer by a chemical bond, e.g., a coordinate bond or a covalent bond. Accordingly, the metal layer may adhere to the dielectric layer.
Claims20
A semiconductor package substrate, comprising:
- a metal layer including a patterned conductor having a metallic interface surface, wherein the metallic interface surface includes a metal ion;
- a dielectric layer including an epoxy resin having a dielectric interface surface;
- and
- an interfacial layer between the metal layer and the dielectric layer, wherein the interfacial layer includes an interfacial layer compound having an end chemically bound to the metal ion of the patterned conductor of the metal layer.
1 more element
A semiconductor package, comprising:
- a package substrate including:
- a metal layer including a patterned conductor having a metallic interface surface, wherein the metallic interface surface includes a metal ion,
- a dielectric layer including an epoxy resin having a dielectric interface surface, and
- an interfacial layer between the metal layer and the dielectric layer, wherein the interfacial layer includes an interfacial layer compound having an end chemically bound to the metal ion of the patterned conductor of the metal layer;
- and
- an integrated circuit mounted on the package substrate and electrically connected to the patterned conductor of the metal layer.
3 more elements
A method, comprising:
- applying an interfacial layer to a dielectric interface surface of an epoxy resin of a dielectric film to functionalize the dielectric interface surface, wherein the interfacial layer includes an interfacial layer compound having an end;
- and
- depositing a metal layer including a patterned conductor having a metallic interface surface on the interfacial layer to chemically bond a metal ion of the metallic interface surface to the end of the interfacial layer compound of the interfacial layer such that the metal layer adheres to the functionalized dielectric interface surface of the dielectric film.
Dependencies are inferred from the claim text.