US 2017/0287825 A1 · FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Abstract

A fan-out semiconductor package include a frame having a through hole; a semiconductor chip disposed in the through hole, and having an active surface, an inactive surface, and a side surface; an encapsulant disposed on one sides of the frame and the semiconductor chip, and in a space between the frame and the semiconductor chip in the through hole, a first conductive layer disposed on a sidewall of the through hole, a second conductive layer disposed on one side of the frame, and connected to the first conductive layer, a line via passing through the encapsulant, and connected to the second conductive layer, and a third conductive layer covering at least the inactive surface of the semiconductor chip on the encapsulant, and connected to the line via.

Claims16

Dependent claims

A fan-out semiconductor package comprising:

a frame having a through hole;
a semiconductor chip disposed in the through hole, and having an active surface having an electrode pad, an inactive surface opposing the active surface, and a side surface connecting the active surface and the inactive surface;
an encapsulant disposed on one sides of the frame and the semiconductor chip, and in a space between the frame and the semiconductor chip in the through hole;
a first conductive layer disposed on a sidewall of the through hole;
a second conductive layer disposed on one side of the frame, and connected to the first conductive layer;
a line via passing through the encapsulant, and connected to the second conductive layer;
and
a third conductive layer covering at least the inactive surface of the semiconductor chip on the encapsulant, and connected to the line via.

5 more elements

Dependencies are inferred from the claim text.

Fan-out semiconductor package and method of manufacturing same

Life of this patent

Fan-out semiconductor package and method of manufacturing same

Life of this patent

Abstract

Claims16