Electronic apparatus with pocket of low permittivity material to reduce electromagnetic interference

2:

• The apparatus according to claim 1, wherein the pocket of low permittivity material formed of an air pocket is completely enclosed by the insulation and the second substrate.

3:

• The apparatus according to claim 2, wherein the air pocket is substantially rectangular in shape located directly below the electrical connection.

4:

• The apparatus according to claim 2, wherein the air pocket extends along the length of the second substrate.

5:

• The apparatus according to claim 1, wherein the first substrate is made of copper.

6:

• The apparatus according to claim 1, wherein the second substrate is made of copper.

7:

• The apparatus according to claim 1, wherein the second substrate is soldered to a third substrate to transfer heat generated during operation.

8:

• The apparatus according to claim 2, wherein a first capacitance is formed between the first substrate and the second substrate and a second capacitance corresponding to the air pocket is formed in series with the first capacitance causing a reduction in an overall capacitance of the electronics apparatus.

9:

• The apparatus according to claim 1, wherein the insulation has uniform thickness under the first switch and the second switch.