Semiconductor Package Having a Source-Down Configured Transistor Die and a Drain-Down Configured Transistor Die

A method of manufacturing a semiconductor package, the method comprising:

• securing a first transistor die secured to a substrate, the first transistor die having a source terminal at a bottom side of the first transistor die which faces the substrate and a drain terminal and a gate terminal at a top side of the first transistor die which faces away from the substrate;
• securing a second transistor die to the substrate, the second transistor die having a drain terminal at a bottom side of the second transistor die which faces the substrate and a source terminal and a gate terminal at a top side of the second transistor die which faces away from the substrate;
• and
• forming a common electrical connection between the drain terminal of the first transistor die and the source terminal of the second transistor die.

A semiconductor package, comprising:

• a substrate;
• and
• at least two pairs of transistor dies secured to the substrate, each pair of transistor dies providing one phase of a multi-phase converter circuit and including a source-down configured transistor die having a source terminal facing the substrate and a drain terminal and a gate terminal facing away from the substrate, and a drain-down configured transistor die having a drain terminal facing the substrate and a source terminal and a gate terminal facing away from the substrate,
• wherein for each pair of transistor dies:
• the drain terminal of the source-down configured transistor die is electrically connected to the source terminal of the drain-down configured transistor die,
• the source-down configured transistor die is a multi-gate MOSFET die and the drain-down configured transistor die is a single-gate MOSFET die,
• wherein the multi-gate MOSFET die comprises a plurality of gate surfaces acting electrically as a single gate for each device included in the die,
• wherein the single-gate MOSFET die comprises a single gate surface acting electrically as a single gate for each device included in the die.