Semiconductor device and an electronic device

A semiconductor device, comprising:

• a first semiconductor chip including a first insulated gate bipolar transistor, and having a first front surface and a first back surface opposite to the first front surface, the first front surface including an emitter electrode pad and a gate electrode pad formed thereover, the first back surface including a collector electrode formed thereover;
• a second semiconductor chip including a diode, and having a second front surface and a second back surface opposite to the second front surface, the second front surface including an anode electrode pad formed thereover, the second back surface including a cathode electrode formed thereover;
• a chip mounting portion having a first surface over which the first semiconductor chip and the second semiconductor chip are mounted, and a second surface opposite to the first surface;
• a first lead;
• a second lead;
• a first conductive member electrically coupled with the first lead;
• a second conductive member electrically coupled with the second lead;
• and
• a sealing body sealing the first semiconductor chip, the second semiconductor chip, a first portion of the first lead, a first portion of the second lead, the first conductive member and the second conductive member, the sealing body having an upper surface located on the same side as the first surface of the chip mounting portion, a lower surface opposite to the upper surface, a first side surface located between the upper surface and the lower surface in a thickness direction of the sealing body, and a second side surface located between the upper surface and the lower surface in the thickness direction of the sealing body, the second side surface being opposite to the first side surface,
• wherein the first semiconductor chip is mounted over the first surface of the chip mounting portion such that the first back surface of the first semiconductor chip faces the first surface the chip mounting portion and such that the first semiconductor chip is arranged between the second semiconductor chip and the second lead in plan view,
• wherein the second semiconductor chip is mounted over the first surface of the chip mounting portion such that the second back surface of the second semiconductor chip faces the first surface the chip mounting portion and such that the second semiconductor chip is arranged between the first semiconductor chip and the first lead in plan view,
• wherein the emitter electrode pad of the first semiconductor chip and the anode electrode pad of the second semiconductor chip are electrically coupled with the first lead via the first conductive member,
• wherein the gate electrode pad of the first semiconductor chip is electrically coupled with the second lead via the second conductive member,
• wherein the collector electrode of the first semiconductor chip and the cathode electrode of the second semiconductor chip are electrically coupled with each other via the chip mounting portion,
• wherein the first lead passes through the first side surface of the sealing body such that the first portion of the first lead is embedded within the sealing body,
• wherein the second lead passes through the second side surface of the sealing body such that the first portion of the second lead is embedded within the sealing body, and
• wherein the second surface of the chip mounting portion is exposed from the sealing body such that the second surface of the chip mounting portion is not located between the upper surface of the sealing body and the lower surface of the sealing body in cross-sectional view.