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US 2017/0287807 A1Published application
Electronics package with improved thermal performance
AssigneeQorvo US, Inc.
InventorsJonathan J. Fain, Mark C. Woods
Life of this patent
Estimating the term…
Abstract
An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.
Claims22
An electronics package comprising:
- a substrate;
- a first set of electronic contact pads on a first surface of the substrate;
- a first set of thermal contact pads on the first surface of the substrate;
- a second set of electronic contact pads on a second surface of the substrate opposite the first surface;
- a second set of thermal contact pads on the second surface of the substrate;
- a plurality of thermal vias in the substrate, each connecting one or more of the first set of thermal contact pads to one or more of the second set of thermal contact pads;
- a flip chip component coupled to the substrate via at least a portion of the first set of electronic contact pads;
- and
- a thermal lid over the flip chip component such that:
- the thermal lid is in contact with a surface of the flip chip component opposite the substrate;
- and
- the thermal lid is coupled to at least a portion of the first set of thermal contact pads.
9 more elements
An apparatus comprising:
- a printed circuit board (PCB);
- a plurality of PCB electronic contact pads on a surface of the PCB;
- a heat spreader on the surface of the PCB;
- and
- an electronics package (EP) comprising:
- a substrate;
- a first set of EP electronic contact pads on a first surface of the substrate;
- a first set of thermal contact pads on the first surface of the substrate;
- a second set of EP electronic contact pads on a second surface of the substrate opposite the first surface, each one of the second set of EP electronic contact pads coupled to a corresponding one of the plurality of PCB electronic contact pads;
- a second set of thermal contact pads on the second surface of the substrate, each one of the second set of thermal contact pads coupled to the heat spreader on the surface of the PCB;
- a plurality of thermal vias in the substrate, each connecting one or more of the first set of thermal contact pads to the second set of thermal contact pads;
- a flip chip component coupled to the substrate via at least a portion of the first set of EP electronic contact pads;
- and
- a thermal lid over the flip chip component such that:
- the thermal lid is in contact with a surface of the flip chip component opposite the substrate;
- and
- the thermal lid is coupled to at least a portion of the first set of thermal contact pads.
14 more elements
Dependencies are inferred from the claim text.