Electronic device provided with a thermal dissipation member

An electronic device, comprising:

• a heat producing component;
• a thermal dissipation structure associated with the heat producing component to radiate heat away therefrom, the thermal dissipation structure comprising:
• a main portion in direct physical contact with the heat producing component;
• first and second secondary portions not in direct physical contact with the heat producing component, each first and second secondary portions forming a loop;
• and
• wherein a distal end of the first secondary portion is in direct physical contact with the main portion and a distal end of the second secondary portion is in direct physical contact with the main portion.

An electronic device, comprising:

• a support wafer;
• a heat producing component supported by the support wafer;
• a thermal dissipation structure associated with the heat producing component to radiate heat away therefrom, the thermal dissipation structure comprising:
• a main portion in direct physical contact with the heat producing component;
• first and second secondary portions not in direct physical contact with the heat producing component;
• and
• wherein the first and second secondary portions extend downwardly from the main portion to the support wafer.