US 2017/0287799 A1 · REMOVABLE IC PACKAGE STIFFENER

Abstract

A stiffener, an IC package and methods of fabrication of an IC package including a removable stiffener are shown. A removable stiffener for use with an integrated circuit (IC), including a plurality of adhesive portions disposed between a surface of the stiffener and a surface of a substrate of the IC is shown. Such a removable stiffener including at least one removal tab is shown. An IC package including a removable stiffener including a plurality of adhesive portions disposed between a surface of the stiffener and a surface of a substrate of the IC is shown. Methods of fabrication of an IC package including a removable stiffener are shown.

Claims16

Dependent claims

A stiffener for use with an integrated circuit (IC) including a substrate having a surface, the stiffener comprising:

a planar portion having a first surface and a second surface;
and
a plurality of adhesive portions disposed between the second surface of planar portion of the stiffener and the surface of the substrate.

Dependencies are inferred from the claim text.

Facts

Application

15/088,998Filed 1 Apr 2016

Published

5 Oct 2017

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

H10W 76/40
Containers; Fillings or auxiliary members therefor; Seals: fillings or auxiliary members in containers, e.g. centering rings
H10W 72/877
On different surfaces: bump connectors and die-attach connectors
H10W 74/15
Characterised by their shape or disposition: on active surfaces of flip-chip devices, e.g. underfills
H10W 90/724
Of bump connectors: between a chip and a stacked insulating package substrate, interposer or RDL

Removable ic package stiffener

Life of this patent

Removable ic package stiffener

Life of this patent

Abstract

Claims16