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US 2017/0287798 A1Published application
Baseplate for an electronic module and method of manufacturing the same
AssigneeInfineon Technologies AG
InventorsFabio BRUCCHI, Davide CHIOLA
Life of this patent
Estimating the term…
Abstract
Various embodiments provide an electronic module comprising a baseplate. A recess is formed in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip. The electronic chip is attached to a substrate or carrier and is placed in the recess.
Claims17
An electronic module, the electronic module comprising:
- a baseplate;
- a recess being formed in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip,
- the electronic chip being attached to a substrate or carrier;
- and
- the electronic chip being placed in the recess.
2 more elements
An electronic power module, the electronic power module comprising:
- a baseplate consisting of an electrically conductive material;
- a recess being formed in one main surface of the baseplate;
- an electronic chip being attached to a substrate or carrier;
- and
- the electronic chip being placed in the recess.
2 more elements
Dependencies are inferred from the claim text.