General four-port on-wafer high frequency de-embedding method
AssigneeTsinghua University
InventorsJun FU, Yu-dong WANG, Jie CUI, Yue ZHAO, Wen-pu CUI, Zhi-hong LIU
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AssigneeTsinghua University
InventorsJun FU, Yu-dong WANG, Jie CUI, Yue ZHAO, Wen-pu CUI, Zhi-hong LIU
Estimating the term…
The present invention provides a general four-port on-wafer high frequency de-embedding method. The method comprises: for each on-wafer de-embedding dummy, building a model considering the distributive nature of high frequency characteristics of the on-wafer de-embedding dummy; obtaining the intrinsic Y-parameter admittance matrix of said N on-wafer de-embedding dummies by calculation or simulation by using said models; and solving the equation set which the corresponding measurement and calculation or simulation data of said on-wafer de-embedding dummies satisfy for the elements of the related admittance matrices of the parasitic four-port network to be stripped in de-embedding and model parameters of models on which said calculation or simulation is based.
A general four-port on-wafer high frequency de-embedding method, comprising the following steps:
A general four-port on-wafer high frequency de-embedding method of passivity, reciprocity and symmetry, comprising the following steps:
The special general four-port on-wafer high frequency de-embedding method according to claim 3, characterized in that solving the equation set YMj=Yee−Yei(YAj(p1, p2, . . . pM)+Yii)−1Yei(j=1,2, . . . , N for the elements of three sub-matrices Yee, Yii and Yei of the admittance matrix Y of the parasitic four-port network to be stripped in de-embedding and said model parameters p1, p2, . . . , pM as unknowns in Step 3.5 comprises the following steps:
Dependencies are inferred from the claim text.