Semiconductor device manufacturing method

A semiconductor device manufacturing method comprising the steps of:

• (a) providing a first semiconductor wafer and a second semiconductor wafer each having a plurality of chip regions arranged in a matrix pattern over a main surface of a semiconductor substrate and scribe regions arranged between the chip regions in a lattice pattern;
• (b) attaching a first tape to the main surface of the first semiconductor wafer and a second tape to the main surface of the second semiconductor wafer and then polishing back surfaces of the first semiconductor wafer and the second semiconductor wafer;
• (c) putting a semiconductor wafer laminate with a protective sheet interposed between the first tape over the main surface of the first semiconductor wafer and the back surface of the second semiconductor wafer, in a moisture-proof bag and sealing the semiconductor wafer laminate in the moisture-proof bag to package the semiconductor wafer laminate;
• (d) transporting the packaged semiconductor wafer laminate by air;
• (e) taking the semiconductor wafer laminate out of the moisture-proof bag and then sucking the back surface of the first semiconductor wafer by a first suction unit, moving the first semiconductor wafer and the first tape onto a stage and attaching a third tape to the back surface of the first semiconductor wafer;
• (f) peeling the first tape from the first semiconductor wafer to expose the main surface of the first semiconductor wafer;
• and
• (g) forming a plurality of semiconductor chips by cutting the first semiconductor wafer along the scribe regions,
• wherein the protective sheet has a first surface and a second surface opposite to the first surface and the first surface has a flat part, a plurality of convex parts projecting from the flat part toward the first surface, and a plurality of concave parts projecting from the flat part toward the second surface,
• wherein a first hole penetrating the protective sheet is made in the convex part, and
• wherein a center of the first hole is closer to a periphery of the convex part than to an apex of the convex part in plan view.

A semiconductor device manufacturing method comprising the steps of:

• (a) providing a plurality of semiconductor wafers each having a plurality of chip regions arranged in a matrix pattern over a main surface of a semiconductor substrate and scribe regions arranged between the chip regions in a lattice pattern;
• (b) sealing a semiconductor wafer laminate in which the semiconductor wafers are stacked with a protective sheet interposed between semiconductor wafers, in a moisture-proof bag to package the semiconductor wafer laminate;
• (c) transporting the packaged semiconductor wafer laminate by air;
• (d) taking the semiconductor wafer laminate out of the moisture-proof bag and then sucking and moving a first semiconductor wafer of the semiconductor wafer laminate to a stage by a first suction unit and attaching a tape to a back surface of the first semiconductor wafer;
• and
• (e) forming a plurality of semiconductor chips by cutting the first semiconductor wafer along the scribe regions,
• wherein the protective sheet has a first surface and a second surface opposite to the first surface and the first surface has a flat part, a plurality of convex parts projecting from the flat part toward the first surface, and a plurality of concave parts projecting from the flat part toward the second surface, and
• wherein a first hole penetrating the protective sheet is made between an apex of the convex part and the flat part.