Shell structure for insulation of a through-substrate interconnect

A method comprising:

• forming in a substrate a first dielectric liner structure;
• forming a conductive structure in the substrate, wherein the first dielectric liner structure is disposed between the conductive structure and a bulk material of the substrate;
• forming in the substrate a second dielectric liner structure;
• and
• forming a through-substrate interconnect (TI) that extends from a first side of the substrate to a second side of the substrate opposite the first side, wherein the conductive structure extends at least partially around a perimeter of the TI, and wherein the second dielectric liner structure is disposed between the TI and the conductive structure.

A system comprising:

• a printed circuit board;
• a packaged integrated circuit device including:
• a substrate including a first side and a second side opposite the first side, the substrate having formed therein:
• a through-substrate interconnect (TI) configured to exchange a signal or a supply voltage between the first side and the second side;
• a conductive structure extending at least partially around a perimeter of the TI;
• a first dielectric liner structure disposed between the conductive structure and a bulk material of the substrate;
• and
• a second dielectric liner structure disposed between the TI and the conductive structure;
• and
• a display coupled to the printed circuit board, the display to generate an image based on an exchange between the printed circuit board and the packaged integrated circuit device.