Apparatus and Method to Improve Plasma Dicing and Backmetal Cleaving Process

An apparatus to improve plasma dicing and a backmetal cleaving process on a substrate that is mounted on an adhesive film, comprising:

• a rotatable chuck assembly including a chuck body having a mount portion defined by a first surface, at least two retainers that are spaced apart from one another and are coupled to the chuck body and radially surround the mount portion, each retainer including a retaining edge, wherein the rotatable chuck assembly further includes a flexible chuck support pad that is attached to the first surface of the mount portion of the chuck body;
• and
• a saw frame assembly including a saw frame body that is configured to be disposed and held between the at least two retainers, the saw frame body having at least two locking edges that are configured to seat against the retaining edges of the at least two retainers, the saw frame body being configured to receive the substrate mounted on the adhesive film.