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US 2017/0287766 A1Published application
Gripper for semiconductor devices
AssigneeSunPower Corporation
InventorsEmmanuel Chua Abas, Vergil Rodriguez Sandoval
Life of this patent
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AssigneeSunPower Corporation
InventorsEmmanuel Chua Abas, Vergil Rodriguez Sandoval
Estimating the term…
A wafer transfer system can include a wafer gripper for picking and placing semiconductor devices. In an embodiment, the wafer gripper can include a first portion, a second portion and a laminate between the first and second portion. In one embodiment, the first portion can comprise glass or tempered glass, where the first portion having at least one vacuum hole and is configured to receive the semiconductor device. In an embodiment, the second portion can include glass or tempered glass, the second portion having configured to use low air pressure from a closed vacuum to vacuum a wafer. In an embodiment, the laminate can bond the first portion to the second portion.
A wafer gripper for semiconductor substrates, comprising:
A method of manufacturing a wafer gripper, the method comprising:
A method of transferring a wafer from a first location to a second location, the method comprising:
Dependencies are inferred from the claim text.