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US 2017/0287757 A1Published application
Damage monitor
OwnerRobert F. Kwasnick, Min Pei +1inventors
InventorsRobert F. Kwasnick, Min Pei, Alan E. Lucero
Life of this patent
Estimating the term…
Abstract
Devices and methods are shown that use sensors to detect physical characteristics of an IC circuit or other device over time. The physical characteristics and time data may be used to calculate a damage metric of the IC circuit or other device. The damage metric may be used to notify a user about a condition of the IC circuit or other device.
Claims21
A semiconductor device, comprising:
- a die;
- one or more sensors proximate to the die;
- and
- a damage metric module in communication with the one or more sensors, wherein the damage metric module is configured to process multiple data points of time and temperature during operation of the die.
1 more element
A semiconductor device, comprising:
- a die;
- one or more sensors proximate to the die;
- and
- a damage metric module in communication with the one or more sensors, wherein the damage metric module is configured to process multiple data points of time and humidity during operation of the die.
1 more element
A method for monitoring the deterioration of a semiconductor device, comprising:
- sensing one or more physical characteristics of a die;
- generating data that directly correlate with the sensed physical characteristics of the die with a damage metric module;
- associating the data with the time the data was sensed;
- and
- processing the one or more data points during operation of the die with the damage metric module.
2 more elements
Dependencies are inferred from the claim text.