Integrated metrology and process tool to enable local stress/overlay correction

A method for correcting stress profile or overlay error on a substrate, comprising:

• performing a measurement process in a metrology tool disposed in a processing system on a substrate to obtain a substrate distortion or an overlay error map;
• determining a surface modification recipe in a computing system based on the substrate distortion or overlay error map obtained from the measurement process in the processing system;
• and
• performing an ion implantation process in a processing chamber disposed in the processing system to correct substrate distortion or overlay error on the substrate.

A method for correcting overlay error on a substrate comprising:

• measuring a film stress of a substrate disposed in a metrology tool in a processing system;
• creating a correlation to the film stress behavior with a database library to determine an ion implantation recipe;
• and
• performing an ion implantation process on selected discrete locations of the substrate using the determined ion implantation recipe in a processing chamber disposed in the processing system.