Management method of substrate processing apparatus and substrate processing system

A substrate processing system including a substrate processing apparatus configured to perform a processing of removing a film on a peripheral portion of a substrate;

• a measurement processing device configured to perform a measurement processing based on an image;
• an information processing device configured to manage information upon the measurement processing;
• and a control device configured to control the substrate processing apparatus,
• wherein the substrate processing apparatus comprises:
• a rotating/holding unit configured to hold and rotate the substrate;
• a processing liquid supply unit configured to supply a processing liquid for removing the film onto the peripheral portion of the substrate;
• and
• an imaging unit configured to image the peripheral portion of the substrate,
• wherein the measurement processing device comprises:
• a controller configured to measure a cut width of the film based on the image obtained by imaging the peripheral portion of the substrate which is processed based on a substrate processing recipe including a set value of the cut width of the film,
• wherein the information processing device comprises:
• a controller configured to create a management list in which identification information of the substrate, the set value of the cut width of the film, a measurement value of the cut width of the film and time information at which a measurement result is obtained are correlated and configured to analyze a state of the processed substrate based on the created management list, and
• wherein the control device comprises:
• a controller configured to make a preset notification to a user based on an analysis result of the information processing device.