Substrate Heating Device And Substrate Heating Method

Abstract

A substrate heating device and substrate heating method is disclosed. The device comprises: a heating layer for transferring heat; a transfer pipe for transferring a gas to a diffusion layer; the diffusion layer for enabling the gas to be uniformly distributed between a conducting layer and the heating layer; and the conducting layer for conducting the gas in the diffusion layer to below a substrate to be heated. The device can uniformly and fully heat the substrate to be heated, thus enabling the to-be-heated substrate to have a more uniform surface temperature, and achieving a better effect in an etching, deposition and/or sputtering process of the substrate to be heated.

Dependencies are inferred from the claim text.