Electronic device package
AssigneeIntel Corporation
InventorsJimin Yao, Eric Li, Shawna Liff
Life of this patent
Estimating the term…
Abstract
Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate, an electronic component disposed on the substrate and electrically coupled to the substrate, and an underfill material disposed at least partially between the electronic component and the substrate. A lateral portion of the underfill material can comprises a lateral surface extending away from the substrate and a meniscus surface extending between the lateral surface and the electronic component.
Claims25
An electronic device package, comprising:
- a substrate;
- an electronic component disposed on the substrate and electrically coupled to the substrate;
- and
- an underfill material disposed at least partially between the electronic component and the substrate, wherein a lateral portion of the underfill material comprises an exposed a lateral surface extending away from the substrate and intersecting a meniscus surface extending between the lateral surface and the electronic component.
(canceled)
An electronic device package, comprising:
- a substrate;
- an electronic component disposed on the substrate and electrically coupled to the substrate;
- and
- an underfill material disposed at least partially between the electronic component and the substrate, wherein a lateral portion of the underfill material extends from a lateral side of the electronic component to the substrate, the lateral portion of the underfill material having an edge between two surfaces of the underfill material, and wherein one of the two surfaces of the underfill material comprises an exposed lateral surface that extends from the substrate.
(canceled)
(canceled)
A method for making an electronic device package, comprising:
- disposing an electronic component on a substrate, such that the electronic component is electrically coupled to the substrate;
- forming a barrier with a sacrificial material about at least a portion of the electronic component;
- disposing an underfill material at least partially between the electronic component and the substrate, wherein flow of the underfill material is mechanically inhibited at least partially by the barrier;
- and
- removing the barrier.
Dependencies are inferred from the claim text.