Semiconductor packages including interposer and methods of manufacturing the same

A method of manufacturing a semiconductor package, the method comprising:

• attaching a semiconductor die to a first surface of an interposer wafer so that die connection portions of the semiconductor die face towards the first surface;
• forming a protecting portion covering the semiconductor die on the first surface of the interposer wafer;
• reducing a thickness of the interposer wafer by recessing a second surface of the interposer wafer opposite to the semiconductor die;
• forming via holes in the interposer wafer having the recessed second surface to expose the die connection portions;
• and
• forming interconnection structures in the via holes and on the recessed second surface of the interposer wafer, each of the interconnection structures including a through electrode portion filling one of the via holes, an external connection portion disposed on the recessed second surface of the interposer wafer, and an extension portion connecting the through electrode portion to the external connection portion.