Package-on-package assembly with wire bonds to encapsulation surface

A microelectronic package, comprising:

• a substrate having first contacts on an upper surface thereof;
• a microelectronic die having a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die;
• wire bonds having bases joined to the first contacts and having edge surfaces between the bases and corresponding end surfaces, the wire bonds having bends therein between the bases and the end surfaces;
• a first portion of the wire bonds interconnected between a first portion of the first contacts and the second contacts;
• the end surfaces of a second portion of the wire bonds above the upper surface of the microelectronic die;
• and
• a dielectric layer above the upper surface of the substrate and between the wire bonds.

A microelectronic package, comprising:

• a substrate having first contacts on an upper surface thereof and second contacts on a lower surface thereof, the substrate defining a hole therein;
• a microelectronic die having a lower surface facing the upper surface of the substrate and having third contacts on the lower surface of the microelectronic die, the microelectronic die positioned over the hole for alignment with the third contacts;
• first wire bonds having bases joined to the first contacts and having edge surfaces between the bases and corresponding end surfaces;
• second wire bonds interconnected between the second contacts and the third contacts;
• and
• a dielectric layer above the upper surface of the substrate and between the wire bonds.