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US 2017/0287732 A1Published application
Water soluble flux with modified viscosity
AssigneeIntel Corporation
InventorKabir J. Mirpuri
Life of this patent
Estimating the term…
Abstract
A one-step water soluble (WS) flux process may reduce residue staining and increase yields for bond grid array (BGA) packages. In one example, the WS flux may use increased amounts of bonding polymer (BP) and reduced amounts of amine to increase viscosity. The increased viscosity may eliminate using a second no-clean flux and enable a single WS flux to both clean the associated substrate and provide stable solder ball support during reflow.
Claims20
A ball grid array (BGA) package, comprising:
- a substrate;
- a plurality of solder balls;
- and
- a water soluble (WS) flux on the substrate to promote connections between the substrate and the solder balls, wherein the WS flux includes around 5% -15% amine and 15% -20% bonding polymer.
1 more element
A method comprising:
- applying a water soluble (WS) flux to a bond pad, wherein an amount of bonding polymer (BP) in the WS flux is greater than an amount of amine in the WS flux;
- placing a solder ball on the WS flux;
- and
- reflowing the WS flux and the solder ball to form a connection between the bond pad and the solder ball.
1 more element
A water soluble (WS) flux, comprising:
- base materials;
- 5-15% amine;
- and
- 15-20% bonding polymer.
1 more element
Dependencies are inferred from the claim text.