Thermosonically bonded connection for flip chip packages
AssigneeSTMicroelectronics S.r.l.
InventorsMauro Mazzola, Battista Vitali, Matteo De Santa
Life of this patent
Estimating the term…
Abstract
A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by etching recesses in a second surface of the substrate, the second surface being opposite the first surface, and plating at least a portion of a top surface of the leads with a layer of finish plating. The method may also include thermosonically bonding the leads to a die by thermosonically bonding the finish plating to the die and encapsulating the die and the leads in an encapsulant.
Claims22
A method of making a package, comprising:
- forming a plurality of finish plating layers on a first surface of a leadframe;
- etching the first surface of the leadframe to form leads, wherein ends of the leads include the finish plating layers;
- thermosonically bonding the finish plating layers directly to bond pads of a semiconductor die by a thermosonic bonding process;
- and
- encapsulating the semiconductor die and the leads in an encapsulant.
A method of forming chip scale packages, comprising:
- forming contact pads on a first surface of a leadframe;
- forming a pattern of a finish plating layer on a second surface of the leadframe, the second surface being opposite the first surface;
- etching the second surface of the leadframe between the patterned finish plating layer to form leads in the leadframe, ends of the leads including the finish plating layers;
- thermosonically bonding the finish plating layers of the leads directly to bond pads of a semiconductor die;
- and
- encapsulating the semiconductor die and the leads in an encapsulant.
15-21. (canceled)
A method comprising:
- forming a patterned layer on a surface of the leadframe, the patterned layer being a finish plating layer;
- forming a plurality of leads by etching the surface of the leadframe between the patterned layer, each of the plurality of leads having an end that includes the finish plating layer;
- thermosonically bonding bond pads of a semiconductor die directly to the finish plating layers;
- and
- encapsulating the semiconductor die, the finish plating layers, and portions of the plurality of leads.
Dependencies are inferred from the claim text.