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AssigneeTokyo Electron Limited
InventorsYoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
Estimating the term…
Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.
A substrate processing apparatus which performs a processing of removing a film on a peripheral portion of a substrate, the substrate processing apparatus comprising:
A processing method of a substrate processing apparatus including a rotating/holding unit configured to hold and rotate a substrate, a first processing liquid supply unit configured to supply a first processing liquid for removing a film on a peripheral portion of the substrate and an imaging unit provided with an opening for imaging the peripheral portion of the substrate, the processing method comprising:
Dependencies are inferred from the claim text.